Tongbeum. Open-Celled Aluminum Foam Heat Sink for Electronics Cooling with Axial Fan Impinging Flow[J
- Kuang Jiujie, Sui Dan, Kim
- Journal of xi’an jiao tong university
Increased miniaturization, higher power densities, and demands on system performance and reliability in electronic systems have necessitated more aggressive heat removal techniques in the thermal management of electronic components. Air jet impingement, especially in conjunction with surface enhancement, is an attractive option since a heat removal compacity similar to liquid cooling may be achieved by this means. Three rectangular pin fin heat sinks of different height were adopted and the heat transfer process within the heat sink under air jet impingement was experimentally studied. First, the thermal resistances ( ab q ) of the three heat sink related to Re and H/D were obtained respectively, and The equation of the average Nusselt number ( Nu ) changing with Re, H/D and fin height( Hf ) on the chip surface which is under the three heat sinks was developed by the least square method as well. The results show that ab q decreases with Re and H/D, but this tend becomes less significant as Re and H/D increase to certain value. The Nu correlated error in terms of Re, H/D and fin height( Hf ) was within 9%. When the range of then Renolds number is 3159~15798, the coefficient of convection heat transfer can reach 500~1100 W/m2•K.