Heat Conduction in Mobile Electronic Equipment: Study on the Effects of Some Key Parameters on Heat Source Temperature Based on a Three-Layer Model

@inproceedings{Nakayama2013HeatCI,
  title={Heat Conduction in Mobile Electronic Equipment: Study on the Effects of Some Key Parameters on Heat Source Temperature Based on a Three-Layer Model},
  author={Wataru Nakayama},
  year={2013}
}
Heat conduction analysis is performed on a model system to survey the effects of geometric and thermal parameters on the temperature of an embedded heat source. A box model has the geometric characteristics of hand-held devices and has a laminar organization composed of a printed circuit board (PCB), air gap, and a system casing. Exploiting the laminar organization and thinness of the laminate an approximate solution is derived. The solution is used to produce a guide for thermal design… CONTINUE READING

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