• DOI:10.1109/EMAP.2012.6507892
• Corpus ID: 30548892

Hard mold UV nanoimprint lithography process

@article{Zhong2012HardMU,
  title={Hard mold UV nanoimprint lithography process},
  author={Yinsheng Zhong and Matthew Ming-Fai Yuen},
  journal={2012 14th International Conference on Electronic Materials and Packaging (EMAP)},
  year={2012},
  pages={1-5}
}

• Yinsheng Zhong, M. Yuen
• Published 1 December 2012
• Chemistry
• 2012 14th International Conference on Electronic Materials and Packaging (EMAP)

Low temperature and low pressure nano-pattern fabrication process is presented. Hard mold UV nanoimprint lithography, processed by SUSS MicroTec MA6, was used for sub-100nm pattern fabrication. The process details including mold fabrication are provided. A comparison between patterns on soft mold and hard mold is given. The governing parameters in hard mold NIL process are identified. UV curable resin AMONIL MMS4 was used as a UV-curable photo resist (PR) in the process, while 4inch Si wafer was the imprinted substrate. Various resist coating thicknesses from 200nm to 500nm were tested. Imprint force was applied by the high pressure N2 gas, in order to get uniform force distribution over the whole imprint area. 88nm width line patterns were transferred successfully to the resin layer. Results evaluation was done by using AFM and SEM pictures. Image from optical microscope is also shown for reference.