Hard mold UV nanoimprint lithography process

  title={Hard mold UV nanoimprint lithography process},
  author={Yinsheng Zhong and Matthew Ming-Fai Yuen},
  journal={2012 14th International Conference on Electronic Materials and Packaging (EMAP)},
  • Yinsheng Zhong, M. Yuen
  • Published 1 December 2012
  • Chemistry
  • 2012 14th International Conference on Electronic Materials and Packaging (EMAP)
Low temperature and low pressure nano-pattern fabrication process is presented. Hard mold UV nanoimprint lithography, processed by SUSS MicroTec MA6, was used for sub-100nm pattern fabrication. The process details including mold fabrication are provided. A comparison between patterns on soft mold and hard mold is given. The governing parameters in hard mold NIL process are identified. UV curable resin AMONIL MMS4 was used as a UV-curable photo resist (PR) in the process, while 4inch Si wafer… 

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