• Corpus ID: 11014663

HOW TO SELECT A HEAT SINK

@inproceedings{Lee1996HOWTS,
  title={HOW TO SELECT A HEAT SINK},
  author={Seri Lee},
  year={1996}
}
With the increase in heat dissipation from microelectronic devices and the reduction in overall form factors, thermal management bmomes a more and more important element of electronic product design. Both the performance reliability and life expectancy of electronic equipment are inversely related to the component temperature of the equipment. The relationship between the reliability y and the operating temperature of a typical silicon semiconductor device shows that a reduction in the… 

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References

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  • Engineering, Physics
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An analytical simulation model has been developed for predicting and optimizing the thermal performance of bidirectional fin heat sinks in a partially confined configuration. Sample calculations are
Closed Form Equation for Thermal Constriction / Spreading Resistances with Variable Resistance Boundary Condition
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