HIGH CURRENT PROPERTIES OF A MICROSPRING CONTACT FOR FLIP CHIP PACKAGING

@inproceedings{Cheng2010HIGHCP,
  title={HIGH CURRENT PROPERTIES OF A MICROSPRING CONTACT FOR FLIP CHIP PACKAGING},
  author={Bowen Cheng and Dirk Debruyker and Ivan Shubin and John E. Cunningham and Alex T. Chow and M. Griere and Jinhui Shi and Karl F. Bohringer and Eugene M. Chow},
  year={2010}
}
The high current properties of a micro spring pressure contact are characterized. The spring has large compliance (>30 µm) compared to other packaging technologies and fits in a 180 µm pitch 2d array. At 250 mA and 65 ˚C, daisy chains of 134 spring contacts in a silicon package show stable resistances and hotspot temperature rises of less than a degree. At 1 amp, failure near the spring tip or body is observed. Finite element modeling is performed to study the current distribution and provide… CONTINUE READING

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