Guest Editorial: 2007 EuroSimE conference on thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems


This special issue includes selected papers presented at the 8th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). This year the conference was organised in London (England) thanks to local organizer Prof. Chris Bailey from University of Greenwich. The annual EuroSimE conference was initiated in 2000 as the only international conference with direct focus on Thermal, Mechanical and Multi-Physics Simulations and Experiments in Micro-Electronics and Micro-Systems. Each year Technical Committee makes a substantial effort to provide high quality papers, presentations, exhibitions and workshops, which highlight the major research, technological and industrial development trends, challenges and roadmaps. Nowadays in most of the leading electronic companies it is a common practise to use numerical prototyping methods and tools. The reason for that is on one hand short-time-to-market, enhanced functionality and improved quality but on the second hand the improved profitability of electronic industry. Actually in order to achieve the above goals it is required to master advanced thermal, mechanical and especially multi-physics modelling methods as well as experimental material characterization techniques. There is a direct relation between proper material characterization and results of numerical prototyping. Improved reliability of electronic products can be achieved if there are properly addressed such problems as adequate failure modes and criteria, which are based on theoretical and experimental characterization. Next, they should be transferred on adequate modelling methods and complex material behaviour description. This requires development of advanced and sophisticated material characterization methods and application of appropriate numerical procedures. One of the current numerical prototyping trends is focused on multi-physics, -scale and -objective problems. Currently, for example, there are a number of modelling techniques, which allow for multi-scale simulations and the same multi-scale failure mechanism and phenomena analysis. In total, six papers out of the proceeding of EuroSimE 2007 have been finally selected, revised and corrected in order to be presented in this issue of Microelectronic Reliability. The selected papers give an overview of the ‘‘hot” current problems and research activities in the area of numerical prototyping in microelectronics, which can be summarised by the key word ‘‘multi”. The papers could be grouped into two main topics:

DOI: 10.1016/j.microrel.2008.04.011

Cite this paper

@article{Wymyslowski2008GuestE2, title={Guest Editorial: 2007 EuroSimE conference on thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems}, author={Artur Wymyslowski}, journal={Microelectronics Reliability}, year={2008}, volume={48}, pages={803-804} }