Growth of CuAl intermetallic compounds in Cu and Cu(Pd) wire bonding

@article{Lu2011GrowthOC,
  title={Growth of CuAl intermetallic compounds in Cu and Cu(Pd) wire bonding},
  author={Y. H. Lu and Yu Wang and Bernd K. Appelt and Yi-Shao Lai and C. Robert Kao},
  journal={2011 IEEE 61st Electronic Components and Technology Conference (ECTC)},
  year={2011},
  pages={1481-1488}
}
In this study, Cu wire bonds are aged at 150, 175, 250, and 350 °C for time ranging from 5 min to 2000 h. The top temperature of 350 °C is chosen to have the fastest kinetics, while maintaining the same types of stable intermetallics (IMCs) according to the Al-Cu binary phase diagram. Two types of Cu wire are used, including bare Cu wire and Pd coated Cu wire. To avoid possible damages from conventional mechanical polishing processes, all cross-sections are carried out by using an Ar ion beam… CONTINUE READING
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