Greenwood–Williamson Model Combining Pattern-Density and Pattern-Size Effects in CMP

  title={Greenwood–Williamson Model Combining Pattern-Density and Pattern-Size Effects in CMP},
  author={Boris Vasilev and Roland Rzehak and Sascha Bott and Peter Kux0308cher and Johann Wolfgang Bartha},
  journal={IEEE Transactions on Semiconductor Manufacturing},
Chemical mechanical planarization (CMP) models which are able to make predictions for a full chip are highly desirable in semiconductor manufacturing. Previous models proposed to this end have largely focused on effects of pattern density. We here extend one of the proposals to include also effects of pattern-size based on a consideration of the roughness of the polishing pad. Experimental data from CMP test structures containing variations of both pattern-density and pattern-size are used to… CONTINUE READING


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Publications referenced by this paper.
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Greenwood–Williamson model for patterndependent planarization

  • R. Rzehak, B. Vasilev
  • Proc. ICPT, 2007, p. 195.
  • 2007
Highly Influential
10 Excerpts

Contact Mechanics

  • K. Johnson
  • 1985
Highly Influential
7 Excerpts

Contact of nominally flat surfaces

  • J. Greenwood, J. Williamson
  • Proc. R. Soc. London, vol. 295, no. 1442, pp. 300…
  • 1966
Highly Influential
6 Excerpts

Effects of pattern characteristics on copper CMP

  • R. Wenbiao, C. Lan, L. Zhigang, Y. Tianchun
  • J. Semicond., vol. 30, no. 4, p. 046001, Apr…
  • 2009

An analytical model for step height reduction in CMP with different pattern densities

  • L. Wu, C. Yan
  • J. Electrochem. Soc., vol. 154, no. 7, pp. H596…
  • 2007
1 Excerpt

Effects of pad properties on material removal in chemical mechanical polishing

  • K. Park, H. J. Kim, O. M. Chang, H. D. Jeong
  • J. Mater. Process. Technol., vol. 187, p. 73, Jun…
  • 2007
1 Excerpt

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