Greenwood–Williamson Model Combining Pattern-Density and Pattern-Size Effects in CMP

@article{Vasilev2011GreenwoodWilliamsonMC,
  title={Greenwood–Williamson Model Combining Pattern-Density and Pattern-Size Effects in CMP},
  author={Boris Vasilev and Roland Rzehak and Sascha Bott and Peter Kux0308cher and Johann Wolfgang Bartha},
  journal={IEEE Transactions on Semiconductor Manufacturing},
  year={2011},
  volume={24},
  pages={338-347}
}
Chemical mechanical planarization (CMP) models which are able to make predictions for a full chip are highly desirable in semiconductor manufacturing. Previous models proposed to this end have largely focused on effects of pattern density. We here extend one of the proposals to include also effects of pattern-size based on a consideration of the roughness of the polishing pad. Experimental data from CMP test structures containing variations of both pattern-density and pattern-size are used to… CONTINUE READING

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