Grain Boundary Diffusion and Electromigration in Cu-Sn Alloy Thin Films and their VLSI Interconnects

@inproceedings{Gupta1997GrainBD,
  title={Grain Boundary Diffusion and Electromigration in Cu-Sn Alloy Thin Films and their VLSI Interconnects},
  author={Devendra Swarup Gupta and Chao Kun Hu and Kok Loong Lee},
  year={1997}
}

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