Glass interposer technology advances for high density packaging

@article{Kuramochi2016GlassIT,
  title={Glass interposer technology advances for high density packaging},
  author={Satoru Kuramochi and Hiroshi Kudo and Miyuki Akazawa and Hiroshi Mawatari and Masaya Tanaka and Yoshitaka Fukuoka},
  journal={2016 IEEE CPMT Symposium Japan (ICSJ)},
  year={2016},
  pages={213-216}
}
As electronic product becomes smaller and lighter with an increasing number of function, the demand for high density and high integration becomes stronger. Interposers for system in package will became more and more important for advanced electronic systems. Silicon interposers with through silicon vias (TSV) and back end of line (BEOL) wiring offer… CONTINUE READING