Glass in Electronic Packaging and Integration: High Q Inductances for 2.35 GHz Impedance Matching in 0.05 mm Thin Glass Substrates

  title={Glass in Electronic Packaging and Integration: High Q Inductances for 2.35 GHz Impedance Matching in 0.05 mm Thin Glass Substrates},
  author={Wu Zihan and Sukhadha Viswanathan and Matthias Jotz and Holger Maune and Matthias Jost and Pulugurtha Markondeya Raj and Venkatesh Sundaram and Rao. R. Tummala},
  journal={2018 IEEE 68th Electronic Components and Technology Conference (ECTC)},
This work demonstrates 50 µm (2.0 mil) thin SCHOTT glass AF32eco as a RF substrate. Superior electrical performance and miniaturized component or package size in both vertical and lateral dimensions compared to traditional components and two-dimensional (2D) packages are shown to be feasible with the 3D fabrication approach with such thin glass. Vias with a diameter of 50µm are made at SCHOTT using laser structuring. Either sides of the glass substrates are coated with a thin layer of a polymer… 

Glass in wafer- and panel-level packaging: Changes, challenges, hurdles and barriers

In principle there exists a large variety of compositions for oxide glasses. Also a variety of hot forming processes is present for glasses, which allows near end shape processing. In particular thin

Attenuation of high Frequency Signals in Structured Metallization on Glass: Comparing Different Metallization Techniques with 24 GHz, 77 GHz and 100 GHz Structures

A number of glass substrates made from the SCHOTT glass AF32_eco in a thickness of 0.1mm are metallized with different processes. On the metallized glass substrates, microstrip lines as well as ring



High-performance electroplated solenoid-type integrated inductor (SI/sup 2/) for RF applications using simple 3D surface micromachining technology

Electroplated solenoid-type integrated inductors (SI/sup 2/s) have been demonstrated to have high performance and small area occupation for GHz applications, using a new, simple, and highly adaptable

Direct copper metallization on glass technology + x-substrate

It is believed that conformal metallization on glass with the highly conductive thick Cu material is expected to enhance the performance for RF electronic devices in the IoT era due to the

Design and Demonstration of Ultra-Thin Glass 3D IPD Diplexers

This paper demonstrates, for the first time, 3D integrated passive device (IPD) diplexers on ultra-thin glass substrates for wireless local area network (WLAN) application in mobile devices. The

A Review of the Timing and Filtering Technologies in Smartphones

Invited PaperIEEE International Frequency Control Symposium, May 9~12, 2016, New Orleans, USA AbstractThe explosive growth of the smartphone market especially in supporting LTE (Long Term Evolution)

Miniaturized Band-Pass filters as Ultra-thin 3D IPDs and Embedded Thinfilms in 3D Glass Modules

  • IEEE Transactions on Components, Packaging and Manufacturing Technology, 2017,
  • 2017

Glass: a universal material class for semi-conductor packaging and further integration

  • Chip Scale Review, 21(3), 37
  • 2017