Free standing thermal interface material based on vertical arrays composites

@article{Leveugle2013FreeST,
  title={Free standing thermal interface material based on vertical arrays composites},
  author={Elodie Leveugle and Laurent Divay and Hung Le Khanh and J. Daon and Evelyne Chastaing and Pierre Le Barny and A. Ziaei},
  journal={19th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)},
  year={2013},
  pages={244-247}
}
In power microelectronics, the trends towards miniaturization and higher performances result in higher power densities and more heat to be dissipated. For large systems, the associated thermal architecture is becoming more and more complex and costly. In most electronic assembly, thermal interface materials (TIM) help provide a path for the heat to be transferred from the hot source to a cooler heat sink but still represent a bottleneck in the total thermal resistance of the system. Increasing… CONTINUE READING