Focused ion beam technology and application in failure analysis

  title={Focused ion beam technology and application in failure analysis},
  author={Yuan Chen and Xiaowen Zhang},
  journal={2010 11th International Conference on Electronic Packaging Technology & High Density Packaging},
Focused ion beam, also known as FIB, is a technique widely used in semiconductor field, such as circuit modification, layout verification, microcircuit failure analysis, mask repair and transmission electron microscope (TEM) specimen preparation of site specific locations. Among these applications, microcircuit failure analysis is a very important one. In the paper, after an introduction to the FIB technology and the operating principles, several applications of FIB for microcircuit failure… CONTINUE READING
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