Focused electron beam induced etching of copper in sulfuric acid solutions

@article{Boehme2015FocusedEB,
  title={Focused electron beam induced etching of copper in sulfuric acid solutions},
  author={Lindsay Boehme and Matthew D. Bresin and Aur{\'e}lien Botman and James K. Ranney and Jeffrey Todd Hastings},
  journal={Nanotechnology},
  year={2015},
  volume={26}
}
We show here that copper can be locally etched by an electron-beam induced reaction in a liquid. Aqueous sulfuric acid (H2SO4) is utilized as the etchant and all experiments are conducted in an environmental scanning electron microscope. The extent of etch increases with liquid thickness and dose, and etch resolution improves with H2SO4 concentration. This approach shows the feasibility of liquid phase etching for material selectivity and has the potential for circuit editing. 

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