Fluidic heterogeneous microsystems assembly and packaging

  title={Fluidic heterogeneous microsystems assembly and packaging},
  author={Wei Zheng and Jaehoon Chung and H. O. Jacobs},
  journal={Journal of Microelectromechanical Systems},
The nonrobotic fabrication of packaged microsystems that contain nonidentical parts has been accomplished by a directed self-assembly process. The self-assembly process uses geometrical shape recognition to identify different components and subsequent bond formation between liquid solder and metal-coated areas to form mechanical and electrical connections. We applied this concept of shape recognition and subsequent formation of contacts to assemble and package microsystems that contained… CONTINUE READING
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