Flip chip design rule development for multiple signal and ground bump configurations

@inproceedings{Staiculescu2000FlipCD,
  title={Flip chip design rule development for multiple signal and ground bump configurations},
  author={Daniela Staiculescu and Joy Laskar},
  year={2000}
}
This paper presents a novel approach for analysis of factors to be considered when designing a flip chip package. The analysis is focused on the use of multiple signal and ground bumps and incorporates the design of an experiment and statistical analysis of the outputs. The multiple ground bump configurations use a modified coplanar waveguide (CPW) launch and improvement in electrical performance with the modified transmission line geometry is demonstrated. For the signal bumps on a traditional… CONTINUE READING

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