Flip-Chip Mounting of an RF IC using Eutectic Solder Bumps

Abstract

For the DECT telephone system, a zero-IF front-end Integrated Circuit (UAA2078) has been designed in Philips' high speed QUBIC BiCMOS process. This IC contains all RF circuits required to directly down-convert the RF signal to the IF frequency around zero. At these high frequencies (1.8 GHz), it is advantageous to use flip-chip as mounting technique. Wide… (More)

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Cite this paper

@article{Baggerman1995FlipChipMO, title={Flip-Chip Mounting of an RF IC using Eutectic Solder Bumps}, author={A Baggerman and J. F. J. M. Caers and A. G. Wagemans}, journal={ESSDERC '95: Proceedings of the 25th European Solid State Device Research Conference}, year={1995}, pages={409-413} }