Flip Chip MPU Module Using High Performance Printed Circuit Board “ALIVH”

Abstract

The authors have developed a Flip Chip MPU module on a high performance printed circuit board “ALIVH”(Any Layer Inner Via Hole Structure) for sub-note PCs using modified stud-bump bonding (SBB) technology. Many MPU modules for sub-note PCs have been massproduced since 1995 in Matsushita Electric, using the SBB technology. However, all of these modules… (More)

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Cite this paper

@inproceedings{Shiraishi1999FlipCM, title={Flip Chip MPU Module Using High Performance Printed Circuit Board “ALIVH”}, author={Tsukasa Shiraishi and Kazuyoshi Amami and Yoshiriro Bessho and Kazunori Sakamaoto and Kazuo Eda and Toru Ishida}, year={1999} }