Flip Chip Joining on FR-4 Substrate Using ACFs

@inproceedings{Seppl2001FlipCJ,
  title={Flip Chip Joining on FR-4 Substrate Using ACFs},
  author={Anne Sepp{\"a}l{\"a} and Seppo Pienimaa and Eero Ristolainen},
  year={2001}
}
Anisotropic conductive adhesive films (ACF) were used to attach daisy-chained test chips on FR4 substrates. The feasibility of ACF joining was studied since it is a potential method for fine-pitch bare-die attachment on low-cost organic substrates. Four types of test chips were used, each having a pitch of different size. One of the chips had an area array… CONTINUE READING