Flexible manufacturing of multichip modules for flip chip ICs

@article{Yee1997FlexibleMO,
  title={Flexible manufacturing of multichip modules for flip chip ICs},
  author={Ian Yee and Robert F. Miracky and J. Reed and Brent Lunceford and Minchuan Wang and D. Cobb and G. Caldwell},
  journal={Proceedings 1997 IEEE Multi-Chip Module Conference},
  year={1997},
  pages={130-132}
}
A quick-turn flexible process for designing, verifying, and manufacturing multichip modules for use with flip chip ICs was developed. The process starts with MCC's prefabricated customizable substrates. Laser based cut and link processes are used to program the necessary wires on the substrate. Laser direct write is also used to redistribute the flip chip area array bond pads to match the bond pads on the substrate. An efficient design to manufacturing process is assisted with the use of a… 
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