Corpus ID: 112270669

Finite element analysis on reliability of soldered joint of J-lead

@inproceedings{Yong2005FiniteEA,
  title={Finite element analysis on reliability of soldered joint of J-lead},
  author={Hu Yong},
  year={2005}
}
  • Hu Yong
  • Published 2005
  • Engineering
  • Finite element method was used to simulate the soldered joint of J-lead of the SOJ (Small Outline J-lead Package). Results indicate that the distortion is obvious, the ceramic carrier with up-warp trend, the J-lead with forth extension trend, but the PCB with little distortion because of the rigidity displacement restrict. The strain of the J-lead soldered joint' soldered heel is bigger than the soldered toe and the center place has the least strain. The stress of the J-lead soldered heel is… CONTINUE READING

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