Fine pitch flex-on-flex (FOF) assembly using nanofiber solder anisotropic conductive films (ACFs) and ultrasonic bonding method

Abstract

Nanofiber/solder ACFs are investigated in terms of ball movement and electrical properties depending on their nanofiber polymer types: polyacrylonitrile (PAN) and polyvinylidene fluoride (PVDF). For both nanofiber solutions, SAC305 (96.5% Sn, 3% Ag, 0.5% Cu with 217°C melting point) conductive solder balls were incorporated into nanofibers which were… (More)

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