Fine pitch Cu/Sn solid state diffusion bonding for making high yield bump interconnections and its application in 3D integration


Low temperature stacking of dies for 3D integration has been gaining interest due to the thermal sensitivity of some advanced node devices such as DRAM. Sn-based solder joint is considered as a promising approach for making die to die interconnections because Sn to Cu bonding temperature is lower and the yield is higher as compared with Cu to Cu bonding… (More)


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