Field-Theoretical Analysis of MIC Packaging Structures with a Three-Dimensional Finite-Difference Method and Modelling by Equivalent Circuits for CAD Application

Abstract

Structures for interconnecting active microwave semiconductor-devices, e.g. FET's and MIC's, with the electrical surrounding or with each other have to be designed more and more carefully when increasing the desired upper frequency limit. Therefore, several connecting structures for device embedding have been examined. Mainly, their applicability for the… (More)

Cite this paper

@article{Christ1987FieldTheoreticalAO, title={Field-Theoretical Analysis of MIC Packaging Structures with a Three-Dimensional Finite-Difference Method and Modelling by Equivalent Circuits for CAD Application}, author={Andreas F. Christ and H. L. Hartnagel}, journal={1987 17th European Microwave Conference}, year={1987}, pages={647-652} }