Fatigue damage behavior of a surface-mount electronic package under different cyclic applied loads ∗

@inproceedings{HuaiHui2014FatigueDB,
  title={Fatigue damage behavior of a surface-mount electronic package under different cyclic applied loads ∗},
  author={Ren Huai-Hui and Wang Xi-Shu},
  year={2014}
}
  • Ren Huai-Hui, Wang Xi-Shu
  • Published 2014
This paper studies and compares the effects of pull–pull and 3-point bending cyclic loadings on the mechanical fatigue damage behaviors of a solder joint in a surface-mount electronic package. The comparisons are based on experimental investigations using scanning electron microscopy (SEM) in-situ technology and nonlinear finite element modeling, respectively. The compared results indicate that there are different threshold levels of plastic strain for the initial damage of solder joints under… CONTINUE READING