Fast electrical-thermal co-simulation using multigrid method for 3D integration

@article{Xie2012FastEC,
  title={Fast electrical-thermal co-simulation using multigrid method for 3D integration},
  author={Jianyong Xie and M. D. Swaminathan},
  journal={2012 IEEE 62nd Electronic Components and Technology Conference},
  year={2012},
  pages={651-657}
}
In this paper, a fast electrical-thermal co-simulation method based on multigrid approach is proposed for simulating 3D systems. Using the proposed approach, accurate voltage/current distribution with temperature effect as well as temperature distribution with Joule heating effect can be obtained efficiently. By ensuring smoothly stretched gridding between die region and package region, fast convergence of multigrid method can be reached for both DC voltage drop and thermal simulations. The… CONTINUE READING
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