Fast data pattern based electromagnetic interference evaluation for IC packaging

Abstract

Electromagnetic interference (EMI) is becoming more serious when the data rate of the digital system continues increasing. However, its modeling and analysis are very challenging. In this paper, a novel electromagnetic superposition method is developed to model the IC packaging electromagnetic emission. It employs the equivalence principle to obtain the… (More)

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Cite this paper

@article{Huang2015FastDP, title={Fast data pattern based electromagnetic interference evaluation for IC packaging}, author={Nick K. H. Huang and Lijun Jiang}, journal={2015 Asia-Pacific Symposium on Electromagnetic Compatibility (APEMC)}, year={2015}, pages={272-274} }