Fast 3-D Thermal Simulation for Integrated Circuits With Domain Decomposition Method


For accurate thermal simulation of integrated circuits (ICs), heat sink components in chip package must be considered. In this letter, techniques based on the domain decomposition method (DDM) are presented for the 3-D thermal simulation of nonrectangular IC thermal model including heat sink and heat spreader. A relaxed nonoverlapping DDM algorithm is… (More)
DOI: 10.1109/TCAD.2013.2273987


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