Failure study of Sn-Ag-Cu lead-free solder joint by digital image speckle analysis (DISA)

Failure analysis of lead-free solder joints for PBGA assemblies subjected to thermal cycling aging is reported. A micro-digital image speckle correlation system (Micro-DISC) was employed for micro-deformation and strain analysis. The Sn-3.8Ag-0.7Cu (SAC) soldered assembly was subject to a temperature ramp from room temperature of 25 degC to 125 degC. The… CONTINUE READING