Failure process of solder joint under mechanical vibration based on a real-time data acquisition method

@article{Zhang2011FailurePO,
  title={Failure process of solder joint under mechanical vibration based on a real-time data acquisition method},
  author={Hongwu Zhang and Fenglian Sun and Yang Liu and Zhen Zhou and Yong Qin},
  journal={2011 International Symposium on Advanced Packaging Materials (APM)},
  year={2011},
  pages={272-274}
}
Dynamic voltage signal across solder joints during mechanical vibration test was monitored and collected real-timely with a self-designed data acquisition system. Failure process of solder joint was studied by processing and analyzing data. In the paper, lifetime of solder joint was also compared by changing solder joint location, solder joint composition… CONTINUE READING