Failure investigation on copper-plated blind vias in PCB

@article{Ji2010FailureIO,
  title={Failure investigation on copper-plated blind vias in PCB},
  author={Li-Na Ji and Yi Gong and Zhen-Guo Yang},
  journal={Microelectronics Reliability},
  year={2010},
  volume={50},
  pages={1163-1170}
}