Failure analysis of assembly defect with IR-OBIRCH from backside

Abstract

In our failure analysis, there were some dual die product which included one control die and power die, and there was no passivation on power die so as to radiate heat conveniently. We may occasionally meet some cases, which revealed simple leakage failure on external pins, such as OUTPUT-GND leakage. However, when we decapped the fail unit from front-side… (More)

Topics

Figures and Tables

Sorry, we couldn't extract any figures or tables for this paper.