Failure Model for Silver Electrochemical Migration

@article{Yang2007FailureMF,
  title={Failure Model for Silver Electrochemical Migration},
  author={Shuang Yang and Aristos Christou},
  journal={IEEE Transactions on Device and Materials Reliability},
  year={2007},
  volume={7},
  pages={188-196}
}
A new model for silver electrochemical migration is presented, which includes the insulation resistance degradation prior to dendritic growth. This failure model reported is based on the calculation of the ion accumulation rate. Failure occurs when the accumulated ion concentration exceeds the threshold. Experimental measurements have been carried out to validate the model. Experiments under various temperature-humidity-bias conditions are reported. 
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