Factors affecting activation energy for pd-coated cu ball bond resistance degradation on Al bond pads in high temperature storage

@article{Hook2017FactorsAA,
  title={Factors affecting activation energy for pd-coated cu ball bond resistance degradation on Al bond pads in high temperature storage},
  author={Michael David Hook and Stevan Hunter and Michael Mayer},
  journal={2017 IEEE 19th Electronics Packaging Technology Conference (EPTC)},
  year={2017},
  pages={1-7}
}
  • M. Hook, S. Hunter, M. Mayer
  • Published 1 December 2017
  • Materials Science
  • 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC)
Copper wire bonds have become a mainstay in many electronics areas, including automotive, where more data is needed regarding the reliability of Cu wire bonds on Al pads in high temperature conditions. Arrhenius models are frequently used to estimate product lifetimes, with the activation energy being the main parameter. Activation energies from 0.46 eV to 1.34 eV have been reported in the literature for similar materials and aging conditions. This apparent inconsistency between the results of… 

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