Fabrication of the Flexible Sensor Using SOI Wafer by Removing the Thick Silicon Layer

@article{Noda2006FabricationOT,
  title={Fabrication of the Flexible Sensor Using SOI Wafer by Removing the Thick Silicon Layer},
  author={Katufumi Noda and Kota Hoshino and Kiyoshi Matsumoto and Isao Shimoyama},
  journal={19th IEEE International Conference on Micro Electro Mechanical Systems},
  year={2006},
  pages={122-125}
}
In this paper, we propose a method to fabricate a flexible sensor, which uses thin single crystal silicon devices for sensing. In this method, we formed sensing devices on the top of an SOI wafer and removed a thick silicon layer from it to make the sensor flexible. To protect the thin silicon structure during the process, we covered it with an elastic… CONTINUE READING