Fabrication of nanoporous polyimide of low dielectric constant


Polyimide is a choice of material widely used in electronic packaging due to its high thermal and mechanical stability and low thermal expansion coefficient and dielectric constant. Two porous polyimides of structure shown in the following figure were successfully synthesised. The reaction scheme involve polycondensation of 3,3',4,4'-biphenyltetracarboxylic… (More)

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@article{Othman2008FabricationON, title={Fabrication of nanoporous polyimide of low dielectric constant}, author={Mohd Bisyrul Hafi Othman and Zulkifli Ahmad and Hazizan Md Akil}, journal={2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT)}, year={2008}, pages={1-4} }