Fabrication of multilayer interconnection materials and bonding film for high integration applications

Abstract

To meet the demands for increased integration and multi functions for multilayer electronic components the related materials and process technique for layer-to-layer interconnection have to be developed together. Using nano-, micro-sized metal powders and epoxy resins conductive via pastes have been formulated. Via conductance was measured before and after… (More)

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@article{Yoo2010FabricationOM, title={Fabrication of multilayer interconnection materials and bonding film for high integration applications}, author={Myong-Jae Yoo and Seong-dae Park and Woo Sung Lee and Ha-kin Hwang}, journal={2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference}, year={2010}, pages={1-4} }