Fabrication of a Micromachined Two-Dimensional Wind Sensor by Au–Au Wafer Bonding Technology

@article{Dong2012FabricationOA,
  title={Fabrication of a Micromachined Two-Dimensional Wind Sensor by Au–Au Wafer Bonding Technology},
  author={Ziqiang Dong and Jingjing Chen and Yukun Qin and Ming Qin and Qing-An Huang},
  journal={Journal of Microelectromechanical Systems},
  year={2012},
  volume={21},
  pages={467-475}
}
The design, fabrication, and performance of a micromachined 2-D wind sensor are presented. The sensor operates based on the detection of temperature and flow-dependent heat distribution on a hot sensing surface. It consists of a silicon sensing chip and a ceramic packaging substrate, in which the sensing chip is bonded to the front side of the ceramic packaging substrate through wafer-level gold bumps. The backside of the ceramic substrate provides a smooth surface for the sensor exposed to the… CONTINUE READING

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