Fabrication of Metal-on-Glass High-Pitch Adapters Between VLSI Electronics and Semiconductor Sensors by Laser Ablation

@article{ReyGarcia2013FabricationOM,
  title={Fabrication of Metal-on-Glass High-Pitch Adapters Between VLSI Electronics and Semiconductor Sensors by Laser Ablation},
  author={Francisco Rey-Garcia and Carmen Bao-Varela and G. F. de la Fuente and Clara G{\'o}mez-Reino and Eliseo Perez and Paloma Cabanas Rodr{\'i}guez and Abraham A. Gallas and Antonio J Pazos and B. Adeva and Ana Alonso and X. Prieto-Blanco},
  journal={Journal of Lightwave Technology},
  year={2013},
  volume={31},
  pages={2327-2331}
}
High Energy Physics experiments make extensive use of silicon sensors for tracking purposes. The high granularity of the modern detectors makes the connection between the segmented sensor channels and the readout electronics very complex. Furthermore, due to the mismatch between the detector pad pitch and the electronics a direct connection is not possible in most of the cases. A new method for the fabrication of pitch adapters is presented using metal-on-glass technology. In this new method… CONTINUE READING