Fabrication of Integrated Vertical Mirror Surfaces and Transparent Window for Packaging MEMS Devices

Abstract

A scheme for creating metal-coated vertical mirrors in silicon, along with an integrated transparent package lid for assembling, packaging, and testing microelectromechanical systems (MEMS) devices is presented. Deep reaction ion etching (DRIE) method described here reduces the loading effect and maintains a uniform etch rate resulting in highly vertical… (More)

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Cite this paper

@article{Agarwal2007FabricationOI, title={Fabrication of Integrated Vertical Mirror Surfaces and Transparent Window for Packaging MEMS Devices}, author={R. Agarwal and Susan L Samson and Sameer Kedia and S. Bhansali}, journal={Journal of Microelectromechanical Systems}, year={2007}, volume={16}, pages={122-129} }