Fabrication of Capacitive Acoustic Resonators Combining 3D Printing and 2D Inkjet Printing Techniques

@inproceedings{Haque2015FabricationOC,
  title={Fabrication of Capacitive Acoustic Resonators Combining 3D Printing and 2D Inkjet Printing Techniques},
  author={Rubaiyet Iftekharul Haque and Erick Ogam and Christophe Loussert and Patrick Benaben and Xavier Boddaert},
  booktitle={Sensors},
  year={2015}
}
A capacitive acoustic resonator developed by combining three-dimensional (3D) printing and two-dimensional (2D) printed electronics technique is described. During this work, a patterned bottom structure with rigid backplate and cavity is fabricated directly by a 3D printing method, and then a direct write inkjet printing technique has been employed to print a silver conductive layer. A novel approach has been used to fabricate a diaphragm for the acoustic sensor as well, where the conductive… CONTINUE READING
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References

Publications referenced by this paper.
Showing 1-10 of 50 references

A Review of Silicon Microphones

P. R. Scheeper, A.G.H. van der Donk, W. Olthuis, P. Bergveld
Sens. Actuators Phys. 1994, • 1994
View 4 Excerpts
Highly Influenced

Advance Materials for Superior Digital Dentistry and Orthodontics,” 2014

Stratasys, “Dental Materials
Available online: http://www.seido-systems.com/doc/dental.pdf • 2015
View 1 Excerpt

Innovator in Electronics, 14 February 2013

Murata Manufacturing Co., LTD., “What Are ImpedanceESR Frequency Characteristics in Capa muRata
Available online: http://www.murata.com/en-us/products/emiconfun/capacitor/2013/02/14/en-20130214-p1 • 2015
View 1 Excerpt

Memory Everywhere, 2013

Thin Film Electronics ASA, “Thinfilm Receives First Order for Brand Protection Solution, ” Thinfilm
Available online: http://www.thinfilm.no/news/thinfilmreceives-first-order-for-brand-protection-system/ • 2015

Réalisation d’objects Électroniques Par Utilization Combine de L’impression 3D et de L’impression

R. I. Haque, X. Boddaert, C. Calmes, P. Benaben
Par Jet de Matière. French Patent Application Number: FR 15/51969, • 2015
View 1 Excerpt

The Future at Your Fingertips

Bliss, A. Printed Electronics
May 2013. Available online: http:// www.computerarts.co.uk/blog/printed-electronics-future-your-fingertips-133664 • 2014

Acreo Swedish ICT , “ Printed Electronics Thinfilm Receives First Order for Brand Protection Solution , ” Thinfilm : Memory Everywhere

Y. Li, D. Lu, C. P. Wong
Electrical Conductive Adhesives with Nanotechnologies • 2013

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