Fabrication of Application Specific Integrated Passive Devices Using Wafer Level Packaging Technologies

@article{Zoschke2007FabricationOA,
  title={Fabrication of Application Specific Integrated Passive Devices Using Wafer Level Packaging Technologies},
  author={Kai Zoschke and M. Jurgen Wolf and M. Topper and Oswin Ehrmann and Thomas Fritzsch and K. Kaletta and F.-J. Schmuckle and Herbert Reichl},
  journal={IEEE Transactions on Advanced Packaging},
  year={2007},
  volume={30},
  pages={359-368}
}
Integrated passives have become increasingly popular in recent years. Especially wafer level packaging technologies offer an interesting variety of different possibilities for the implementation of integrated passive components. In this context, particularly the fabrication of integrated passive devices (IPDs) represents a promising solution regarding the reduction of size and assembly costs of electronic systems in package (SiP). IPDs combine different passive components (R,L ,C ) in one… CONTINUE READING
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