Fabrication and thermal performance of a thin flat heat pipe with innovative sintered copper wick structure

@article{Popova2006FabricationAT,
  title={Fabrication and thermal performance of a thin flat heat pipe with innovative sintered copper wick structure},
  author={N B Popova and Ch. Schaeffer and Yvan Avenas and G. Kapelski},
  journal={Conference Record of the 2006 IEEE Industry Applications Conference Forty-First IAS Annual Meeting},
  year={2006},
  volume={2},
  pages={791-796}
}
The goal of this research work is to develop and validate the design of a double-sided electronic substrate, part of a multilayer three-dimensional (3D) package, with an integrated heat exchanger (thin flat heat pipe) in order to evacuate the required total power losses of about 35 W. The paper describes the fabrication processes of a flat heat pipe and the… CONTINUE READING