Fabrication and measurements of an individually addressable micro-probe electrode array using silicon through-glass via

Abstract

In this study, a micro-probe electrode array with independent interconnections through the substrate has been developed using LRS(Low Resistance Silicon) via and glass reflow process. The silicon vias have electrical resistance less than 2 Ω because the boron ion in the borosilicate glass wafer can diffuse into the LRS pillars during glass reflow… (More)

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Cite this paper

@article{Shin2017FabricationAM, title={Fabrication and measurements of an individually addressable micro-probe electrode array using silicon through-glass via}, author={Young-Min Shin and Yong-Kweon Kim and Seung-Ki Lee and Jae-Hyoung Park}, journal={2017 IEEE 30th International Conference on Micro Electro Mechanical Systems (MEMS)}, year={2017}, pages={648-651} }