Fabrication and characterization of ultrathin fine-pitch flexible polyimide interposer

@article{Huang2015FabricationAC,
  title={Fabrication and characterization of ultrathin fine-pitch flexible polyimide interposer},
  author={Wei-Han Huang and Chun-Yi Wang and Yu-Jung Huang and Shen-Li Fu},
  journal={2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)},
  year={2015},
  pages={111-114}
}
A three-dimensional system-in-package (3-D SiP) based on silicon carriers or an interposer is a fast-emerging technology that offers system design flexibility and the integration of heterogeneous technologies. A passive interposer, which is a way to bridge the feature gap between the integrated circuit (IC) and the package substrate, is a key building block… CONTINUE READING