Fabrication and Modeling of Nitride Thin-Film Encapsulation Based on Anti-Adhesion-Assisted Transfer Technique and Nitride/BCB Bilayer Wrinkling

  • Seonho Seok
  • Published 2016 in
    IEEE Transactions on Components, Packaging and…

Abstract

This paper presents buckled nitride thin-film encapsulation using anti-adhesion layer-assisted transfer technique and benzocyclobutene (BCB)/nitride bilayer wrinkling due to elastic property mismatch between the two attached materials. A 900-nm silicon nitride film is deposited on a Si carrier wafer coated with hydrophobic monolayer, and then nonpatterned… (More)

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