Fabrication Techniques for Thin-Film Silicon Layer Transfer

  title={Fabrication Techniques for Thin-Film Silicon Layer Transfer},
  author={S. L. Holl and Cindy Colinge and Shao Song and R. Varasala and Karl D. Hobart and F. J. Kub},
New, cost effective fabrication processes for bonding and thinning silicon wafers for improving device performance and creating 3-D structures were investigated. Wafer bonding and de-bonding are key fabrication steps for many applications such as 3-D devices. Double bond transfer and single bond processes to fabricate silicon thin films on permanent substrates were investigated. Polymer and direct bonding techniques were studied to create both permanent and temporary bonds. De-bonding methods… CONTINUE READING