Fabricating capacitive micromachined ultrasonic transducers with a novel silicon-nitride-Based wafer bonding process

@article{Logan2009FabricatingCM,
  title={Fabricating capacitive micromachined ultrasonic transducers with a novel silicon-nitride-Based wafer bonding process},
  author={Andrew S. Logan and J. T. W. Yeow},
  journal={IEEE Transactions on Ultrasonics, Ferroelectrics and Frequency Control},
  year={2009},
  volume={56}
}
We report the fabrication and experimental testing of 1-D 23-element capacitive micromachined ultrasonic transducer (CMUT) arrays that have been fabricated using a novel wafer-bonding process whereby the membrane and the insulation layer are both silicon nitride. The membrane and cell cavities are deposited and patterned on separate wafers and fusion-bonded in a vacuum environment to create CMUT cells. A user-grown silicon-nitride membrane layer avoids the need for expensive silicon-on… CONTINUE READING
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