Corpus ID: 146805160

FLIP CHIPTEST STRUCTURE BACKGROUND OF THE INVENTION

@inproceedings{2017FLIPCS,
  title={FLIP CHIPTEST STRUCTURE BACKGROUND OF THE INVENTION},
  author={},
  year={2017}
}
  • Published 2017
A flip chip test Structure is disclosed. The flip chip test Structure utilizes a Substrate used in flip chip package to replace the conventional transformer of a flip chip wafer probe card. The Substrate-transformer replacement reduces the cost and Simplifies the flip chip wafer probe card manufacturing proceSS Since the Substrate is already avail able and matches the chip being tested while the transformer needs additional design and custom fabrication which are expensive and time-wasting for… Expand