Eye-diagram simulation and analysis of a high-speed TSV-based channel

Abstract

In this paper, the worst-case and statistical eye-diagrams of high-speed TSV-based channel are simulated and analyzed. To analyze the electrical characteristic of TSV-based channel, the eye-diagrams with various TSV and silicon interposer interconnect structures are simulated and compared each other. In addition, the single-channel bandwidth in accordance… (More)
DOI: 10.1109/3DIC.2013.6702327

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